KLA TENCOR 2132
BRIGHT-FIELD WAFER INSPECTION
VINTAGE: 1995, AUG
WAFER SIZE: 200MM

Comments: Serial number W21XX639. The system was deinstalled in september 2002 and until that date was upgraded with various hardware and software upgrades.
Facilities: 120v 3 phase 25A per phase
KLA2132 Board Configuration
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MAIN CARD CAGE
DP 710-683424-001 REV AA
DF 710-661726-00 BD1
API 710-658036-00 REV C1
API 710-658041-20 REV E0
UP 710-658046-00 REV F0
XINT 710-658176-00 REV A0
YINT 710-658172-00 REV H0
XINT 710-658176-00 REV A0
YINT 710-658172-00 REV H0
CT 710-655651-20 REV C0
CT 710-655651-20 REV C0
MM 710-659412-00 REV C0
MM 710-659412-00 REV C0
MC 710-658232-20 REV H0
IF1 710-658086-20 REV E0

AUXILIARY CARD CAGE
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DF 710-678525-001 REV AB
DD 710-650044-20 REV DB0
DP 710-678545-00 REV B1
RTF 710-652840-20 REV D3
710-659485-20 REV??

General Description
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The KLA 2132 is capable of inspecting at the following rates:
Sensitivity: 0.62 ——- Speed: 5 sec/cm2
Sensitivity: 0.39 ——- Speed: 15 sec/cm2
Sensitivity: 0.25 ——- Speed: 30 sec/cm2
and includes the following:-
wafer inspection module for 4, 5, 6 or 8 inch wafer size image Computer Minimum inspectable feature size of 0.25 um in die to die mode Defect Clustering and Auto Review Sampling Blanket Wafer Inspection Automated Inspection Automatic Focusing SECS-GEM KLA SAT segmented auto threshold imaging processing hardware and software using mean and range functions on the KLA 2132 and KLA 2135 platforms that allows. improved inspection performance on noisy surfaces like CMP and metal reduced inspection setup time enhanced threshold algorithm for all process levels KLA ADC Automated Defect classification Package Includes image processing and analysis software for inspection station .The system has internally two computers: one is the system computer, which controls the machine in run mode; and the other is the ADC computer, which controls the machine in automatic review mode (you can also do manual review mode). The ADC Manager is not included. Fully automatic, non-contact wafer alignment Uses image recognition without special test site requirement Accomodates SEMI standard 25 wafer cassettes Uses pick-and-place, random access wafer handling system Image hard copy Remote image access XV Tencor 6000 loader
SUBSTRATES: For silicon wafers conforming to SEMI standard M1.1
Wafer diameter (mm): 100 100 125 150 200
Wafer thickness (?m): 525 625 625 675 725
SENSITIVITY AND INSPECTION SPEED:
Die to Die Mode
Sensitivity (um) Speed (sec/cm2)
0.60 05
0.50 1.5
0.40 15

Cell to Cell Mode
Sensitivity (um) Speed (sec/cm2)
0.30 05
0.25 30
0.20 15
Full performance specifications are available on request